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6L Mobile Phone PCB

Layers 6L,HDI (1+4+1)
Thickness 1.0mm
Material FR4
Inner Cu 17um
Outter Cu 35um
Surface finished ENIG
Min hole size standard PTH 0.20mm,blinded hole 0.10mm
Min. line width /space 75um/75umum
The product application fields Mobile Phone

Layers 6L HDI(1+4+1)
Thickness 1.0mm
Material FR4
Inner thickness 17um
Outter thickness 35um
Surface finished immersion gold + OSP
Min hole size 0.2mm(standard PTH),0.10mm(blinded hole)
Min. line width /space 0.075mm/0.075mm
The product application fields mobile phone
 

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